Highland Capital Management LLC Boosts Stock Holdings in Amkor Technology, Inc. (NASDAQ:AMKR)

Highland Capital Management LLC lifted its stake in Amkor Technology, Inc. (NASDAQ:AMKR) by 6.6% in the fourth quarter, according to the company in its most recent disclosure with the Securities and Exchange Commission. The firm owned 7,814 shares of the semiconductor company’s stock after purchasing an additional 482 shares during the period. Highland Capital Management LLC’s holdings in Amkor Technology were worth $201,000 at the end of the most recent quarter.

Several other institutional investors and hedge funds have also recently bought and sold shares of the stock. Capital Performance Advisors LLP acquired a new stake in Amkor Technology in the 3rd quarter valued at about $39,000. Larson Financial Group LLC raised its holdings in Amkor Technology by 46.3% in the third quarter. Larson Financial Group LLC now owns 1,834 shares of the semiconductor company’s stock valued at $56,000 after acquiring an additional 580 shares in the last quarter. Ulland Investment Advisors LLC purchased a new position in Amkor Technology in the third quarter worth approximately $82,000. Quarry LP grew its holdings in Amkor Technology by 421.8% during the 3rd quarter. Quarry LP now owns 3,136 shares of the semiconductor company’s stock worth $96,000 after acquiring an additional 2,535 shares in the last quarter. Finally, Blue Trust Inc. increased its position in shares of Amkor Technology by 36.9% in the 4th quarter. Blue Trust Inc. now owns 3,418 shares of the semiconductor company’s stock valued at $88,000 after purchasing an additional 922 shares during the last quarter. 42.76% of the stock is owned by institutional investors and hedge funds.

Amkor Technology Trading Down 1.0 %

AMKR opened at $24.61 on Friday. The firm has a market cap of $6.07 billion, a price-to-earnings ratio of 16.63 and a beta of 1.83. Amkor Technology, Inc. has a 52 week low of $23.36 and a 52 week high of $44.86. The business’s 50 day moving average is $25.98 and its two-hundred day moving average is $29.17. The company has a quick ratio of 1.84, a current ratio of 2.06 and a debt-to-equity ratio of 0.21.

Amkor Technology Increases Dividend

The firm also recently declared a quarterly dividend, which was paid on Monday, December 23rd. Investors of record on Wednesday, December 4th were given a $0.0827 dividend. This is an increase from Amkor Technology’s previous quarterly dividend of $0.08. The ex-dividend date was Wednesday, December 4th. This represents a $0.33 annualized dividend and a yield of 1.34%. Amkor Technology’s dividend payout ratio is 22.30%.

Analyst Upgrades and Downgrades

Several equities research analysts have recently issued reports on the stock. KeyCorp decreased their price objective on shares of Amkor Technology from $38.00 to $34.00 and set an “overweight” rating for the company in a research report on Tuesday, October 29th. Melius Research downgraded Amkor Technology from a “strong-buy” rating to a “hold” rating in a report on Monday, January 6th. The Goldman Sachs Group dropped their price objective on Amkor Technology from $36.00 to $32.00 and set a “neutral” rating on the stock in a report on Tuesday, October 29th. Melius cut Amkor Technology from a “buy” rating to a “hold” rating and decreased their target price for the stock from $34.00 to $30.00 in a research note on Monday, January 6th. Finally, DA Davidson dropped their price target on shares of Amkor Technology from $40.00 to $36.00 and set a “buy” rating on the stock in a research note on Tuesday, October 29th. Six research analysts have rated the stock with a hold rating and five have issued a buy rating to the company. According to MarketBeat.com, the stock presently has a consensus rating of “Hold” and a consensus price target of $35.50.

Amkor Technology Profile

Amkor Technology, Inc provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage.