Fabrinet (NYSE:FN) Releases Earnings Results, Misses Expectations By $0.10 EPS

Fabrinet (NYSE:FN) issued its quarterly earnings results on Monday. The technology company reported $2.38 earnings per share for the quarter, missing the consensus estimate of $2.48 by ($0.10), Zacks reports. Fabrinet had a return on equity of 18.08% and a net margin of 10.28%. Fabrinet updated its Q3 2025 guidance to 2.550-2.630 EPS.

Fabrinet Price Performance

FN stock opened at $226.85 on Tuesday. The stock has a market capitalization of $8.23 billion, a price-to-earnings ratio of 26.85 and a beta of 0.92. The business has a fifty day moving average price of $231.04 and a 200 day moving average price of $234.45. Fabrinet has a fifty-two week low of $159.69 and a fifty-two week high of $281.79.

Analysts Set New Price Targets

A number of analysts have weighed in on the company. Needham & Company LLC began coverage on Fabrinet in a report on Tuesday, November 5th. They set a “buy” rating and a $280.00 price target for the company. B. Riley downgraded shares of Fabrinet from a “neutral” rating to a “sell” rating and decreased their price target for the stock from $194.00 to $178.00 in a research report on Wednesday, November 20th. Finally, Barclays began coverage on Fabrinet in a research note on Thursday, November 14th. They issued an “equal weight” rating and a $292.00 price objective for the company. One analyst has rated the stock with a sell rating, three have assigned a hold rating and three have assigned a buy rating to the company. According to data from MarketBeat.com, the stock presently has an average rating of “Hold” and an average price target of $252.14.

About Fabrinet

Fabrinet provides optical packaging and precision optical, electro-mechanical, and electronic manufacturing services in North America, the Asia-Pacific, and Europe. The company offers a range of advanced optical and electro-mechanical capabilities in the manufacturing process, including process design and engineering, supply chain management, manufacturing, printed circuit board assembly, advanced packaging, integration, final assembly, and testing.